Sawatec hotplates for thermal treatment of wafers/resists.
- Bake in HMDS vapor for adhesion improvement
- Hotplate based Soft-Bake and Hard-Bake
- Temperature stability up to 250°C
- Optional purge with nitrogen
- Substrate size from pieces, up to 200mm (round) and 150x150mm (square)
- Initial conditioning and dehydration of substrate
- Hardening of resists before exposure and other processes (e.g. etching).